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Specially processed mixed resins for high purity applications such as pharmaceutical and semiconductor rinse applications. Semiconductor and microelectronic grades that minimize leachable TOC, sodium, and other contaminants are available.
DuPont Resin AmberLite HPR900 (OH) anion [7CF] 99113868. Fully compatible drop-in replacement for AMBERSEP™ 900 OH, 10039263.
DuPont Resin AmberTec MR-300 UPW (H/OH) MB [5CF] 12018715 for DOWEX™ Monosphere™ MR-3 UPW H/OH, 128382.
DuPont Resin AmberTec MR-450 UPW (H/OH) MB [5CF] 12018716 for DOWEX™ Monosphere™ MR-450 UPW H/OH, 129795.
DuPont Resin AmberTec UP6040 (H/OH) MB [7 CF] 12018796 for AMBERJET™ UP6040, 10031265.
DuPont Resin AmberTec UP6150 (H/OH) MB [7 CF] 12018803 for AMBERJET™ UP6150, 10031407.
DuPont Resin AmberTec UP650 (H) CATION [5 CF] 12018711 for DOWEX™ Monosphere™ 650C UPW H, 124125.
Evoqua NR-30 PPQ is a 1:1 chemical equivalent of C-361 MEG PPQ (H) and A-464 MEG PPQ (OH). These resins are produced using selected starting resins meeting Evoqua specifications and are processed to have very low TOC leachables, boron, and dynamic sodium levels for use in the semiconductor market. They also offer very quick rinse up.
Evoqua NR-30 MEG is a 1:1 chemical equivalent of C-361 MEG (H) and A-464 MEG (OH). C-361 MEG (H) is a 10% cross-linked gel strong acid cation exchange Resin. A-464 MEG (OH) is a Type I porous strong base gel anion Resin. C-361 MEG (H) and A-464 MEG (OH) are specially processed to provide low TOC leachables. The resins are checked kinetically to produce 18+ megohm resistivity and provide excellent mixed bed separation.
Evoqua NR-6 SG is a 1:1 chemical equivalent of C-211 SG (H) and A-284 SG (OH). C-211 SG (H) is an 8% cross-linked gel strong acid cation exchange Resin. A-284 SG (OH) is a Type I strong base gel anion Resin. C-211 SG (H) and A-284 SG (OH) are specially processed to provide low TOC leachables and analyzed kinetically to ensure they are capable of producing 17 megohm mixed bed deionized water.
